Lapped Wafer / Etched Wafer

Spec No.

100NPL

125NPL

150NPL

100PBL

125PBL

150PBL

Growth method

CZ

Type

N

P

Dopant

Ph

B

Diameter

100mm

125mm

150mm

100mm

125mm

150mm

Orientation

<111>, <110>, <100>

<111>, <110>, <100>

Edge Profile

11° or 22°

Resistivity

0.001-100 Ohm-cm

0.001-100 Ohm-cm

Thickness

170 ~ 750μm

TTV

<5μm

Bow/Warp

<40μm

Frontside Surface

Lapped or Etched

Backside Surface

Lapped or Etched